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SUP60N10-18P
Vishay Siliconix
SPECIFICATIONS T J = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
V DS
V GS(th)
I GSS
V DS = 0 V, I D = 250 μA
V DS = V GS , I D = 250 μA
V DS = 0 V, V GS = ± 20 V
100
2.5
4.5
± 250
V
nA
V DS = 100 V, V GS = 0 V
1
Zero Gate Voltage Drain Current
I DSS
V DS = 100 V, V GS = 0 V, T J = 125 °C
50
μA
V DS = 100 V, V GS = 0 V, T J = 175 °C
250
On-State Drain Current a
I D(on)
V DS ≥ 10 V, V GS = 10 V
V GS = 10 V, I D = 15 A
50
0.015
0.0183
A
Drain-Source On-State Resistance a
R DS(on)
V GS = 10 V, I D = 15 A, T J = 125 °C
0.027
0.033
Ω
V GS = 8.0 V, I D = 10 A
0.018
0.023
Forward Transconductance a
g fs
V DS = 15 V, I D = 15 A
33
S
Dynamic b
Input Capacitance
C iss
2600
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge c
C oss
C rss
Q g
V GS = 0 V, V DS = 50 V, f = 1 MHz
230
80
48
75
pF
Gate-Source
Charge c
Q gs
V DS = 50 V, V GS = 10 V, I D = 50 A
16
nC
Gate-Drain Charge
c
Q gd
13
Gate Resistance
Turn-On Delay Time
c
R g
t d(on)
f = 1 MHz
0.25
1.1
12
2.4
20
Ω
Rise Time c
Turn-Off Delay Time c
Fall Time c
t r
t d(off)
t f
V DD = 50 V, R L = 1.0 Ω
I D ? 50 A, V GEN = 10 V, R g = 1 Ω
10
18
8
20
35
15
ns
Drain-Source Body Diode Characteristics T C = 25 °C b
Continuous Current
Pulsed Current
I S
I SM
60
100
A
Forward Voltage a
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
V SD
t rr
I RM(REC)
Q rr
I F = 15 A, V GS = 0 V
I F = 50 A, dI/dt = 100 A/μs
0.85
80
4
160
1.5
120
240
V
ns
A
nC
Notes:
a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
Document Number: 65003
S09-1096-Rev. A, 15-Jun-09
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